IC Package Integration Lead

Department Icon IT / Software Development & Related
102+ Applicants
Posted: 1 month ago
4-7 years
Austin Metro Area, Texas, United States
work from office

Posted: 1 month ago
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Applicants: 102+
Job Description
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Job Description

• Work with cross-functional teams and lead package integration and architecture efforts. • Work with 3rd party and OSAT to bring packaging solution from concept to HVM Drive industry with advanced package solutions and specs. • Work to bring innovative packaging solutions from concept to mass production, including package, module, and technology development.• People managerial skills highly desirable.• Travel – 5-10%
  • BS and 20+ years of relevant industry experience.
  • We are looking for someone with experience in Semiconductor Packaging Design, Process & Technology Development, Managerial skills highly desired.
  • Good understanding of cross-functional packaging areas: Si floor plan, package layout and architecture, enabling process technologies, thermal, mechanical, SI/PI, material, component & system level reliability, testing, and FA.
  • Knowledgeable in advanced packaging technologies: Knowledge and insight to deliver high density / high performance interconnects in various form factor, thermo-mechanical, reliability, and cost constraints.
  • Background and Knowledge of Cellular/Connectivity/PMU packaging highly desirable.
  • Excellent problem solving with strong physics and fundamentals.
  • Looking to get Placed? Try our Placement Guarantee Plan

  • Excellent communication skills that enable the candidate to work well with internal cross functional teams and overseas suppliers.
  • Multi-functional coverage on package layout (Cadence APD/Allegro), critical signal integrity / power integrity, thermal, design rules, BOM, design for manufacturing, reliability, and cost.
  • Ability to work independently and take on projects with minimum supervision.
  • Ability to lead and manage teams.

Skills

Testing

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About Company

Apple Inc., formerly Apple Computer, Inc., is a Silicon Valley–based multinational technology company headquartered in Cupertino, California. It designs, manufactures, and markets premium consumer electronics, software, and online services. Iconic products include the iPhone, iPad, Mac, Apple Watch, and Apple TV, alongside services such as Apple Music, iCloud, Apple Pay, Apple Arcade, Apple TV+, and the App Store. Operating systems now span iOS, iPadOS, macOS, watchOS, and visionOS.

As of August 2025, Apple ranks #3 globally by market capitalization (≈ US $3.4 trillion) and reported FY 2024 revenue of US $391 billion. It remains the second‑largest smartphone maker and fourth‑largest PC vendor worldwide, while expanding into AI‑powered devices, sustainable technology solutions, and mixed‑reality platforms like the Apple Vision Pro.

For professionals exploring Apple India careers, the company offers opportunities across hardware, software, design, retail, and operations, with office hubs in Bengaluru, Hyderabad, Mumbai, and Gurugram. Apple’s interview process in India is known for its rigor, cultural fit focus, and innovation‑driven assessment — attracting engineers, designers, and business talent passionate about shaping future‑ready technology.

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Application Deadline

09 Jun 26, 04:49 PM IST

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IC Package Integration Lead

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