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Job Description
In this role, the Engineer will apply and lead Broadcom&aposs proven design methodology and milestone flow to meet Broadcom&aposs rigorous criteria
for achieving Right-first time silicon.
Candidate should have very good experience in layout activities of block and level. Should be well experienced in floor-planning,
partitioning, placement, clock tree synthesis, route and physical verification.
Responsibilities include, but not limited to:
- Understanding of SoC for top-down/bottom-up physical design integration in 5nm and lower technologies
- Must have deep functional knowledge of P&R flows, should be able to catch up quickly on internal flows, adapt.
- Implement timing and functional ECO
- P&R, Extraction, Physical verification, work towards STA closure
- Build automation flows wherever needed/adapt to existing flows for re-use
- Must be proficient in any of the Cadence/Synospys/Mentor EDA tools for P&R, PV, STA, ECO
- Needs to be automation savvy with high expertise in one of the programming languages used in the industry
- Clearly know requisites for executing his/her job and lead by example
- Bring tangible improvement in TAT with better quality
- MSEE/MSCS 3+ years (BSEE/BSCS 5+ years)
- A deep understanding of backend digital design flow
- Proficient in timing constraints, physical constraints
Looking to get Placed? Try our Placement Guarantee Plan
- Proficient in handling EDA tools across floorplan/partition/placement/cts/route stages for SoC TOP.
- Proficient with backend EDA tools viz, Genus/Innovus/Quantus/Tempus, DC/Star-RCXT/PT, PrimeRail/Voltus, Redhawk
- Proficiency in Tcl and Perl
- Excellent analytical skills
- Shown ability to collaborate in a multi-functional environment, cross-site or cross-time zone
Skills
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About Company
Broadcom Limited is a diversified global semiconductor leader built on 50 years of innovation, collaboration and engineering excellence. Broadcom’s extensive product portfolio serves multiple applications within four primary end markets: wired infrastructure, wireless communications, enterprise storage and industrial & others.
Applications for our products in these end markets include: data center networking, home connectivity, broadband access, telecommunications equipment, smartphones and base stations, data center servers and storage, factory automation, power generation and alternative energy systems, and displays.
Broadcom Limited combines global scale, engineering depth, broad product portfolio diversity and superior execution and operational focus to deliver category-leading connectivity products so its customers can build and grow successful businesses today and in the future.
Broadcom Inc. is a global infrastructure technology leader built on 50 years of innovation, collaboration and engineering excellence. With roots based in the rich technical heritage of AT&T/Bell Labs, Lucent and Hewlett-Packard/Agilent, Broadcom focuses on technologies that connect our world.
Through the combination of industry leaders Broadcom, LSI, Broadcom Corporation, Brocade, CA Technologies and Symantec, the company has the size, scope and engineering talent to lead the industry into the future.
- Shipped Trident 4C, Industry’s Highest Performance Security Switch
- Partnered with Tencent to Accelerate Commercialization of Co-Packaged Optics Network Switch
- Shipped Tomahawk 5, Industry’s Highest Bandwidth Switch Chip to Accelerate AI/ML Workloads
- Delivered World’s First 50G Automotive Ethernet Switch
- Announced Availability of World’s First Wi-Fi 7 Ecosystem Solutions
- Safeguarded the SAN with Gen 7 Fibre Channel and Extended Leadership with the Industry’s Highest Density 64G Switch
2021
- Announced Industry’s First 100G/lane Optical PAM-4 DSP PHYs with Integrated TIA and Laser Driver
- Launched Broadcom Software Group
- Introduced World’s Lowest Power L1/L5 GNSS Receiver for Mobile and Wearable Applications
- Pioneered Adaptive Protection to Maximize Endpoint Security
- Introduced World’s First 64G Fibre Channel Emulex Host Bus Adapters
- BCM4389 Powered the World’s First Wi-Fi 6E Smartphone
2020
- Delivered Complete End-to-End 800G Solutions for Hyperscale Data Center and Cloud Infrastructure
- Broke New Ground with Trident SmartToR, Converging Switching, Routing, and L4-L7 Services
- Expanded Tomahawk 4 Family, Increasing Leadership in the World’s Highest Bandwidth Switch/Routing Silicon
- Debuted Industry’s First 5nm ASIC for Data Center and Cloud Infrastructure
- Announced World’s First Automotive IEEE 802.3ch Multigigabit PHYs and Multilayer Switches with MACsec Support
- Unveiled Industry’s First Gen 7 64Gb/s Fibre Channel Switching Platforms Enabling an Autonomous SAN
- Delivered Innovative Software to Silicon Integration with Industry’s First AI-Driven Network Monitoring Solution
- Announced World’s First Wi-Fi 6E Mobile Chip and Most Comprehensive Portfolio of Wi-Fi 6E Access Point Solutions
Important dates & deadlines?
Application Deadline
07 Apr 25, 04:28 PM IST
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