Please click on the Apply to verify the status of jobs posted more than 15 days ago, as they may have expired. Similar Jobs
Job Description
As part of TLR team (top-level-route), R&D Engineer is primarily responsible for :-
- Place and Route, CTS, Routablity analysis with respect to congestion.
- Well versed in physical verification aspect, DRC, LVS, Antenna, LUP, ( chip finishing and Tapeout)
- Integration of analog blocks, Meeting RC requirements for manual/special signals
- Good understanding of calibre rule deck of DRC/LVS/DFM,DFY, ERC and ESD latchup.
- Responsible for all the integrity checks (chip finishing) and post Tapeout eJob view release,
- Good scripting knowledge perl and TCL, familiar with caliber, Innovus,
- Understanding of VLSI fabrication process,
- Implementing timing ECOs. Implementing IR drop fixes, SPEF extraction, signal EM fixes, Noise analysis.
- Open to new responsibilities in context of rapid technological change.
- Good communication skills, work closely with the team members to accomplish PD milestone.
- Secondary competencies :- Good understanding of CTS, STA, PTSI and timing.
Skills
HtmlIf a job posting appears fraudulent, asks for payment, contains misleading information, or violates our guidelines, please report it immediately. Our team will review it promptly, Jobaaj does not charge any fee from the applicants.
About Company
Broadcom Limited is a diversified global semiconductor leader built on 50 years of innovation, collaboration and engineering excellence. Broadcom’s extensive product portfolio serves multiple applications within four primary end markets: wired infrastructure, wireless communications, enterprise storage and industrial & others.
Applications for our products in these end markets include: data center networking, home connectivity, broadband access, telecommunications equipment, smartphones and base stations, data center servers and storage, factory automation, power generation and alternative energy systems, and displays.
Broadcom Limited combines global scale, engineering depth, broad product portfolio diversity and superior execution and operational focus to deliver category-leading connectivity products so its customers can build and grow successful businesses today and in the future.
Broadcom Inc. is a global infrastructure technology leader built on 50 years of innovation, collaboration and engineering excellence. With roots based in the rich technical heritage of AT&T/Bell Labs, Lucent and Hewlett-Packard/Agilent, Broadcom focuses on technologies that connect our world.
Through the combination of industry leaders Broadcom, LSI, Broadcom Corporation, Brocade, CA Technologies and Symantec, the company has the size, scope and engineering talent to lead the industry into the future.
- Shipped Trident 4C, Industry’s Highest Performance Security Switch
- Partnered with Tencent to Accelerate Commercialization of Co-Packaged Optics Network Switch
- Shipped Tomahawk 5, Industry’s Highest Bandwidth Switch Chip to Accelerate AI/ML Workloads
- Delivered World’s First 50G Automotive Ethernet Switch
- Announced Availability of World’s First Wi-Fi 7 Ecosystem Solutions
- Safeguarded the SAN with Gen 7 Fibre Channel and Extended Leadership with the Industry’s Highest Density 64G Switch
2021
- Announced Industry’s First 100G/lane Optical PAM-4 DSP PHYs with Integrated TIA and Laser Driver
- Launched Broadcom Software Group
- Introduced World’s Lowest Power L1/L5 GNSS Receiver for Mobile and Wearable Applications
- Pioneered Adaptive Protection to Maximize Endpoint Security
- Introduced World’s First 64G Fibre Channel Emulex Host Bus Adapters
- BCM4389 Powered the World’s First Wi-Fi 6E Smartphone
2020
- Delivered Complete End-to-End 800G Solutions for Hyperscale Data Center and Cloud Infrastructure
- Broke New Ground with Trident SmartToR, Converging Switching, Routing, and L4-L7 Services
- Expanded Tomahawk 4 Family, Increasing Leadership in the World’s Highest Bandwidth Switch/Routing Silicon
- Debuted Industry’s First 5nm ASIC for Data Center and Cloud Infrastructure
- Announced World’s First Automotive IEEE 802.3ch Multigigabit PHYs and Multilayer Switches with MACsec Support
- Unveiled Industry’s First Gen 7 64Gb/s Fibre Channel Switching Platforms Enabling an Autonomous SAN
- Delivered Innovative Software to Silicon Integration with Industry’s First AI-Driven Network Monitoring Solution
- Announced World’s First Wi-Fi 6E Mobile Chip and Most Comprehensive Portfolio of Wi-Fi 6E Access Point Solutions
Important dates & deadlines?
Application Deadline
18 May 25, 01:16 PM IST
Similar Jobs
View All
Don't Miss out any Updates
Subscribe now for the latest job alerts
and never miss an update
R&D Engineer
Share with
