Job Description
- Analog layout designer providing onsite support for advanced nodes, working with global layout and design team.
- Candidate should work independently on block level and IP level Analog layout design, coordinating with the circuit designer & the layout team
- Candidate should have minimum 8+ years of hands-on experience in Analog or RF layout.
- Should have worked on floorplan and layout for analog modules like SerDes, ADC/DAC, PLL, etc.
- Should have worked on and top-level integration
- Should have a good understanding of analog layout concepts for deep sub-micron processes and knowledge of fabrication process, preference will be given to FinFet experience candidates.
- Should have a good understanding of ESD, latch-up, EM, and strong skills debugging DRC, LVS, and antenna errors.
- Job Complexity: Works on complex issues where analysis of situations or data requires an in-depth evaluation of variable factors. Exercises judgment in selecting methods, techniques and evaluation criteria for obtaining results. Networks with key contacts outside own area of expertise.
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- Supervision: Determines methods and procedures on new assignments and may coordinate activities of other personnel (Team Lead).
- Experience with Cadence tools and TSMC processes are preferred
Skills
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About Company
Broadcom Limited is a diversified global semiconductor leader built on 50 years of innovation, collaboration and engineering excellence. Broadcom’s extensive product portfolio serves multiple applications within four primary end markets: wired infrastructure, wireless communications, enterprise storage and industrial & others.
Applications for our products in these end markets include: data center networking, home connectivity, broadband access, telecommunications equipment, smartphones and base stations, data center servers and storage, factory automation, power generation and alternative energy systems, and displays.
Broadcom Limited combines global scale, engineering depth, broad product portfolio diversity and superior execution and operational focus to deliver category-leading connectivity products so its customers can build and grow successful businesses today and in the future.
Broadcom Inc. is a global infrastructure technology leader built on 50 years of innovation, collaboration and engineering excellence. With roots based in the rich technical heritage of AT&T/Bell Labs, Lucent and Hewlett-Packard/Agilent, Broadcom focuses on technologies that connect our world.
Through the combination of industry leaders Broadcom, LSI, Broadcom Corporation, Brocade, CA Technologies and Symantec, the company has the size, scope and engineering talent to lead the industry into the future.
- Shipped Trident 4C, Industry’s Highest Performance Security Switch
- Partnered with Tencent to Accelerate Commercialization of Co-Packaged Optics Network Switch
- Shipped Tomahawk 5, Industry’s Highest Bandwidth Switch Chip to Accelerate AI/ML Workloads
- Delivered World’s First 50G Automotive Ethernet Switch
- Announced Availability of World’s First Wi-Fi 7 Ecosystem Solutions
- Safeguarded the SAN with Gen 7 Fibre Channel and Extended Leadership with the Industry’s Highest Density 64G Switch
2021
- Announced Industry’s First 100G/lane Optical PAM-4 DSP PHYs with Integrated TIA and Laser Driver
- Launched Broadcom Software Group
- Introduced World’s Lowest Power L1/L5 GNSS Receiver for Mobile and Wearable Applications
- Pioneered Adaptive Protection to Maximize Endpoint Security
- Introduced World’s First 64G Fibre Channel Emulex Host Bus Adapters
- BCM4389 Powered the World’s First Wi-Fi 6E Smartphone
2020
- Delivered Complete End-to-End 800G Solutions for Hyperscale Data Center and Cloud Infrastructure
- Broke New Ground with Trident SmartToR, Converging Switching, Routing, and L4-L7 Services
- Expanded Tomahawk 4 Family, Increasing Leadership in the World’s Highest Bandwidth Switch/Routing Silicon
- Debuted Industry’s First 5nm ASIC for Data Center and Cloud Infrastructure
- Announced World’s First Automotive IEEE 802.3ch Multigigabit PHYs and Multilayer Switches with MACsec Support
- Unveiled Industry’s First Gen 7 64Gb/s Fibre Channel Switching Platforms Enabling an Autonomous SAN
- Delivered Innovative Software to Silicon Integration with Industry’s First AI-Driven Network Monitoring Solution
- Announced World’s First Wi-Fi 6E Mobile Chip and Most Comprehensive Portfolio of Wi-Fi 6E Access Point Solutions
Important dates & deadlines?
Application Deadline
25 Nov 26, 06:40 PM IST
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Analog Layout Engineer
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