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Job Description
Job Requirements:
- Bachelors degree with 12 years of experience or a Masters degree with over 10 years of experience.
- Proficiency in using Cadence tools (Virtuoso Layout, Layout XL, Cadence Schematic Capture, and verification tools - Calibre & Hercules).
- Strong layout knowledge in submicron processes (e.g., 7nm, 5nm, 3nm, 2nm).
- Understand and apply layout guidelines, new process rules, and technical requirements for high-quality layouts.
- Manage scheduling, timelines, and layout floor-planning.
- Ensure end-to-end deliverables are completed with high quality and within the planned schedule.
- Adapt quickly to new methodologies and communicate effectively with the SOC and library teams.
- Strong experience in memory layout design and physical verification (LVS, DRC, ERC, Antenna, Electro Migration).
- Experience with Cadence Layout tools (Virtuoso XL, VXL, or EXL) and Calibre verification tools.
- Proficiency in floor-planning, hierarchy layout, and chip integration.
- Solid understanding of memory architecture and RC requirements, with the ability to plan signal and power routing.
- Ability to lead teams, train junior engineers, and manage projects effectively.
- Strong knowledge of memory layout topology; experience with memory compilers is preferred.
- Knowledge of AI, layout automation, and script/SKILL programming is preferred.
- Ability to lead new technology reviews to document layout methodologies, flows, and guidelines.
- Self-reliant with the ability to work both independently and collaboratively.
Skills
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About Company
Broadcom Limited is a diversified global semiconductor leader built on 50 years of innovation, collaboration and engineering excellence. Broadcom’s extensive product portfolio serves multiple applications within four primary end markets: wired infrastructure, wireless communications, enterprise storage and industrial & others.
Applications for our products in these end markets include: data center networking, home connectivity, broadband access, telecommunications equipment, smartphones and base stations, data center servers and storage, factory automation, power generation and alternative energy systems, and displays.
Broadcom Limited combines global scale, engineering depth, broad product portfolio diversity and superior execution and operational focus to deliver category-leading connectivity products so its customers can build and grow successful businesses today and in the future.
Broadcom Inc. is a global infrastructure technology leader built on 50 years of innovation, collaboration and engineering excellence. With roots based in the rich technical heritage of AT&T/Bell Labs, Lucent and Hewlett-Packard/Agilent, Broadcom focuses on technologies that connect our world.
Through the combination of industry leaders Broadcom, LSI, Broadcom Corporation, Brocade, CA Technologies and Symantec, the company has the size, scope and engineering talent to lead the industry into the future.
- Shipped Trident 4C, Industry’s Highest Performance Security Switch
- Partnered with Tencent to Accelerate Commercialization of Co-Packaged Optics Network Switch
- Shipped Tomahawk 5, Industry’s Highest Bandwidth Switch Chip to Accelerate AI/ML Workloads
- Delivered World’s First 50G Automotive Ethernet Switch
- Announced Availability of World’s First Wi-Fi 7 Ecosystem Solutions
- Safeguarded the SAN with Gen 7 Fibre Channel and Extended Leadership with the Industry’s Highest Density 64G Switch
2021
- Announced Industry’s First 100G/lane Optical PAM-4 DSP PHYs with Integrated TIA and Laser Driver
- Launched Broadcom Software Group
- Introduced World’s Lowest Power L1/L5 GNSS Receiver for Mobile and Wearable Applications
- Pioneered Adaptive Protection to Maximize Endpoint Security
- Introduced World’s First 64G Fibre Channel Emulex Host Bus Adapters
- BCM4389 Powered the World’s First Wi-Fi 6E Smartphone
2020
- Delivered Complete End-to-End 800G Solutions for Hyperscale Data Center and Cloud Infrastructure
- Broke New Ground with Trident SmartToR, Converging Switching, Routing, and L4-L7 Services
- Expanded Tomahawk 4 Family, Increasing Leadership in the World’s Highest Bandwidth Switch/Routing Silicon
- Debuted Industry’s First 5nm ASIC for Data Center and Cloud Infrastructure
- Announced World’s First Automotive IEEE 802.3ch Multigigabit PHYs and Multilayer Switches with MACsec Support
- Unveiled Industry’s First Gen 7 64Gb/s Fibre Channel Switching Platforms Enabling an Autonomous SAN
- Delivered Innovative Software to Silicon Integration with Industry’s First AI-Driven Network Monitoring Solution
- Announced World’s First Wi-Fi 6E Mobile Chip and Most Comprehensive Portfolio of Wi-Fi 6E Access Point Solutions
Important dates & deadlines?
Application Deadline
03 Oct 26, 06:14 PM IST
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Sr. Memory Layout Design Engineer
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