Project Manager II

(JD) – Tape-Out Program Manager / Technical Program Manager (Semiconductor) Position: Technical Program Manager (Tape-Out) Experience: 8-15 Years Role Summary We are seeking an experienced Technical Program Manager (TPM) to lead and manage ASIC/SoC tape-out programs from concept through silicon delivery. The TPM will coordinate cross-functional teams including Architecture, Design, Verification, Physical Design, DFT, CAD, Product Engineering, and Foundry partners to achieve successful tape-out milestones. Key Responsibilities Drive end-to-end semiconductor product development and tape-out schedules. Create and maintain integrated program plans, milestones, and dependencies. Track critical tape-out deliverables and sign-off readiness. Coordinate across Design, Verification, Physical Design, DFT, Packaging, and Foundry teams. Identify program risks, issues, and mitigation plans. Lead project status reviews and executive reporting. Manage schedule alignment between internal teams and external vendors. Ensure closure of critical path items before tape-out. Track engineering metrics, resource utilization, and budget. Facilitate program reviews, go/no-go decisions, and tape-out readiness assessments. Manage change requests, ECOs, and project scope adjustments. Support silicon bring-up and post-silicon activities. Required Skills Semiconductor Domain ASIC/SoC Development Lifecycle Tape-Out Process RTL to GDSII Flow Physical Design DFT Concepts Design Verification Timing Closure DRC/LVS Sign-off Silicon Validation Foundry Engagement Program Management Project Planning & Scheduling Stakeholder Management Risk Management Dependency Tracking Budget Management Executive Communication Resource Planning Vendor Management Tools Azure DevOps (ADO) Jira Microsoft Project Excel / Power BI Confluence Smartsheet Preferred Qualifications Bachelor's or Master's degree in Electronics, VLSI, Computer Engineering, or related field. Experience managing multiple ASIC/SoC tape-outs. Knowledge of semiconductor manufacturing and foundry processes. PMP, PMI-ACP, or Agile certification preferred. Success Metrics On-time Tape-Out Delivery Schedule Adherence Sign-off Readiness Risk Closure Rate Silicon Success Rate Budget Compliance TPM Deliverables for Tape-Out Programs If you're interviewing or positioning yourself as a Semiconductor TPM, you can highlight: Program planning and milestone management Cross-functional coordination ADO/JIRA governance Risk and dependency management Executive dashboards and reporting Tape-out readiness reviews Foundry coordination Budget and resource tracking Post-silicon issue management Requirement traceability and closure tracking