IBMS & Structured Cabling Design (AI Data Centers) - SME

Job Title: Subject Matter Expert (SME) – IBMS & Structured Cabling Design (AI Data Centers)

Location: Mumbai

Department: : AI Datacenter Design Engineering & Technical Architecture Tea

Reports To: Head of Design

Position Overview

We are seeking an industry-leading Subject Matter Expert (SME) – Integrated Building Management Systems (IBMS) & Structured Cabling Design to serve as the ultimate technical authority for control automation, monitoring networks, and ultra-high-density fiber optic infrastructure across our AI data center portfolio.

You will define global design standards for BMS architecture, DCIM integration, environmental/leak monitoring, and high-speed network cabling. This role ensures our building automation systems seamlessly control critical liquid cooling loops while our structured cabling pathways support massive East-West fabric traffic and 100 kW to 150 kW+ per rack AI cluster topologies.

Key Responsibilities

1. IBMS, Automation & DCIM Architecture

Control System Topology: Design robust BACnet/IP, Modbus, and SNMP control architecture for real-time monitoring and automated feedback loops governing Coolant Distribution Units (CDUs), primary chillers, dry coolers, and high-voltage electrical trains.

Liquid Cooling Control Integration: Architect high-speed automated control sequences, flow balancing algorithms, dynamic pressure differential monitoring, and emergency shut-off valves for direct-to-chip and immersion liquid cooling systems.

DCIM & Environmental Monitoring: Lead design and integration of Data Center Infrastructure Management (DCIM) platforms, continuous thermal mapping, dynamic power metering, and high-sensitivity water/chemical leak detection networks.

2. Structured Cabling & Optical Network Engineering

Ultra-High Density Fiber Design: Architect high-count single-mode and multi-mode optical fiber trunking networks (MPO/MTP connectors, OS2/OM5 fiber) engineered for 400G/800G/1.6T InfiniBand and Ethernet AI fabrics.

AI Cluster Connectivity: Design intra-hall and inter-hall cable pathways, Main Distribution Areas (MDA), Horizontal Distribution Areas (HDA), and optical patch fields optimized for ultra-dense GPU rack layouts (100 kW to 150 kW+ per rack).

Physical Pathway Architecture: Specify overhead and underfloor cable tray systems, optical raceways, fire-stopping penetrations, and pathway segregation protocols to prevent thermal obstruction and signal degradation.

3. Peer Review, Standards & Compliance

Design Validation: Perform deep-dive peer reviews of low-voltage drawings, IBMS network schematics, software integration logic, and telecommunications cabling layouts developed by MEP design consultants.

Industry Compliance: Enforce strict adherence to TIA-942, ISO/IEC 11801, BICSI data center standards, and cybersecurity protocols for operational technology (OT) networks.

Failure Analysis & Escalation: Act as the escalation lead for IBMS network latency failures, sensor calibration errors, optical insertion loss issues, or BMS/DCIM telemetry gaps during commissioning or live operations.

Qualifications & Requirements

Experience:12–15+ years in data center low-voltage, automation, and telecommunications engineering, with at least 5+ years as a lead designer/SME for hyperscale facilities.

Domain Mastery: Technical authority in BMS/DCIM protocols (BACnet, Modbus, SNMP), high-density fiber optronics (MTP/MPO 400G+), liquid cooling control integration, and continuous leak detection.

AI Workload Focus: Proven track record designing IBMS telemetry and structured cabling for 100 kW to 150 kW+ rack densities and high-density GPU fabric clusters.

Education & Credentials: Bachelors degree in Electrical Engineering, Electronics & Telecommunications, or Computer Engineering (RCDD or DCDC certification highly preferred).

Key Skills: OT network architecture, DCIM platform integration, fiber insertion loss budgeting, BMS sequence of operations (SOO) design, and optical pathway routing