HFCL - Vice President - R&D

About The Job

• Job Title : Vice President (VP) Engineering R&D (Communication Products)
• Location : Bangalore
• Job Type : Full-Time

About The Role

We are seeking a dynamic and experienced Vice President (VP) of Engineering to lead our Research & Development (R&D) division for communication products, including Access Points, UBR-P2P, P2MP, and Network Switches.

The ideal candidate will have a strong background in wireless communication technologies, networking, and embedded systems.

This role requires strategic vision, hands-on technical expertise, and leadership skills to drive innovation and ensure successful product development.

Key Responsibilities

• Lead and oversee the entire R&D team, ensuring the successful development of communication products.
• Define the technology roadmap and drive innovation in wireless networking, RF design, and embedded systems.
• Manage the design, development, testing, and deployment of Access Points, UBR-P2P, P2MP, and Network Switches.
• Collaborate with cross-functional teams including Product Management, Manufacturing, and Sales to align technical developments with business goals.
• Ensure compliance with industry standards (IEEE 802.11, Wi-Fi, 5G, IoT, etc.) and regulatory requirements.
• Drive cost optimization and performance improvements in hardware and firmware design.
• Mentor and develop a team of engineers, fostering an innovative and high-performance culture.
• Stay updated with the latest networking technologies, protocols, and emerging trends to maintain a competitive edge.
• Work closely with external partners, vendors, and research institutions to explore new advancements.

• Bachelors/Masters/PhD in, Computer Science, or related field.
• 15+ years of experience in wireless communication, networking, and embedded systems development.
• Proven expertise in Access Points, UBR-P2P, P2MP, Ethernet Switches, and RF technologies.
• Strong knowledge of network protocols, software-defined networking (SDN), and cloud-managed networking.
• Experience in leading large-scale engineering teams and managing multiple product lines.
• Hands-on experience in embedded firmware development (C, C++, Linux, RTOS).
• Understanding of hardware design (PCB, RF, ASIC, FPGA) and firmware integration.
• Strong problem-solving skills with a strategic and analytical mindset.
• Excellent leadership, communication, and stakeholder management skills.

• Experience with Wi-Fi 6/6E/7, IoT, and AI-driven networking solutions.
• Knowledge of network security, cloud computing, and edge computing architectures.
• Experience in patent filings and R&D grants.

• Be at the forefront of cutting-edge wireless communication and networking innovations.
• Lead a highly talented R&D team in shaping the future of connectivity.
• Competitive compensation, stock options, and career growth opportunities.

If you are passionate about leading R&D in next-generation communication products, apply now to be part of our growing team!

(ref:hirist.tech)