R&D Scientist

Business Unit: MAES

Division: Packaging & Board Assembly

Challenge Yourself and Impact the Future!

MacDermid Alpha Electronics Solutions, a business segment of Element Solutions Inc (NYSE: ESI), is renowned worldwide for its commitment to revolutionizing the electronics industry. With a legacy spanning over a century, we have continually set new benchmarks for excellence, reliability and sustainability in electronic materials.

• Wafer Level Packaging - Revolutionizing wafer fabrication processes for enhanced efficiency and performance
• Circuitry Solutions - Tailored solutions to meet the dynamic demands of modern circuitry
• Electronics Assembly Solutions - Innovating semiconductor, surface mount technology, and power electronics assembly for unparalleled reliability
• Advanced Materials and Joining - Engineering polymer and metal joining solutions for optimally performing circuits
• Film & Smart Surface Solutions - Transforming electronics with cutting-edge materials and technologies for enhanced functionality and reliability
• Micromax – Elevating electronics through high-performing, specialized inks and pastes

Across diverse sectors including automotive, consumer electronics, mobile devices, telecom, data storage, infrastructure, and AI, MacDermid Alpha Electronics Solutions has earned the trust of manufacturers worldwide. Our comprehensive range of high-quality solutions and technical services enables the entire electronics supply chain, empowering businesses to thrive in todays competitive landscape.

We embody the Elements of our Culture- our 5Cs; Challenge, Commit, Collaborate, Choose, and Care. These core values are the foundation of our organization which our employees embrace in their interactions with customers, colleagues and other stakeholders, to drive financial performance and create a rewarding work environment.

Who are we looking for

This position is a part of MacDermid Alpha Electronics Solutions (MAES) R&D team. Primary purpose of this position will be to develop soldering /interconnecting and allied materials per business requirements, evaluate alternative raw materials in products, evaluate products per customer requirements, operation and maintenance of laboratory instruments, documentation and presentation of test results.

What will you be doing

• Use creative problem-solving knowledge for scientific research and development.
• Plan technical pathways to develop new products as per business requirements.
• Utilize knowledge of Materials science, Chemistry, analytical instrumentation, in developing industrially useful technologies for PCB and semiconductor assembly.
• Develop test methods and test capabilities to characterize /evaluate materials per project requirements
• Conduct experiments in laboratory, including formulations and other sample preparation, product characterization, product performance and reliability testing per project specifications or customer requirements.
• Demonstrates strong proficiency in Design of Experiments, statistical analysis, and root-cause investigation to accelerate materials and process development
• Document laboratory procedures and results, analyze test data, prepare technical reports following quality requirements of the organization.
• Present and discuss technical findings within work group and with internal /external customers.
• Maintain inventory of raw materials and other supplies as required.
• Calibrate and maintain laboratory instruments and ensure safety and cleanliness of the workplace.

• M. E. or M. Tech. in Material Science, Chemical Engineering or Polymer with 4 - 6 years of working experience in industrial or academic research
• Or Ph. D. in Material Science, Chemical Engineering or Polymer.
• Strong understanding about principles of materials science to correlate chemical structure, composition, and processing conditions with mechanical, thermal, and electrical properties of materials.
• Understanding of analytical techniques used for material characterization. Ability to take the ownership of various instruments will be preferred.
• Working knowledge of advanced semiconductor packaging, SiP integration, interfacial interactions, thermal management, adhesion mechanisms, and package reliability concepts. Basic understanding of solder metallurgy, soldering processes, and wafer-level packaging technologies is preferred.
• Focuses on team goals and supports team members
• Proactively seeks and incorporates feedback from peers and stakeholders
• Awareness of safety, cleanliness, and quality
• Experience with Microsoft Office, Statistical analysis

• Motivated to learn new tasks, new concepts, new applications, etc
• Ability to work as individual and as a part of a cross-functional and intercultural team
• Excellent good communication skill (written and verbal) in English
• Good Analytical (problem solving) skills and Strategic (adaptability, sense of urgency) thinking

• Competitive gross salary with an attractive performance-based bonus.
• Group Medical Insurance coverage of INR 5 lakhs for self, spouse, and up to two dependent children.
• Group Personal Accident Insurance.
• Group Term Life Insurance.
• Two complimentary meals on all working days.
• A professional work environment with opportunities for learning and career development.

All qualified applications will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, pregnancy, genetic information, disability, status as a protected veteran, or any other protected category applicable under federal, state and local laws.