Engineer/Associate Engineer AI & Automation Engineer

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• Engineer/Associate Engineer – AI & Automation Engineer
• Micron Technology
• Hyderabad - Phoenix Aquila
• 1-3 years
• Today
• $14.5K–22.9K/yr
• Full-time
• Onsite

Skills Required

• LLM
• Machine Learning
• Python
• Data Analytics
• Data Pipelines
• Dashboards
• Predictive Models
• Engineering Automation Scripting
• DOE
• SPC
• Digital Twins
• Physics-informed Machine Learning

Description

Micron Technology is a world leader in innovating memory and storage solutions, focusing on accelerating the transformation of information into intelligence.

Company: Micron Technology

Qualification

• Bachelors in Mechanical Engineering
• Bachelors in Electrical Engineering
• Bachelors in Electronics Engineering
• Bachelors in Semiconductor Engineering
• Masters in Mechanical Engineering
• Masters in Electrical Engineering
• Masters in Electronics Engineering
• Masters in Semiconductor Engineering

• Develop and deploy AI/ML models for design validation, process optimization, and simulation acceleration
• Build intelligent design assistants and co-pilot systems for engineers
• Automate design, routing, simulation, and validation workflows
• Create data pipelines integrating design, simulation, and manufacturing data
• Apply DOE, SPC, and ML-driven analytics for yield and quality improvement
• Collaborate across design, simulation, and manufacturing teams
• Translate engineering problems into scalable AI and automation solutions

• Micron prohibits the use of child labor and complies with all applicable laws, rules, regulations, and international and industry labor standards
• Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates
• Candidates are encouraged to use AI tools to enhance their resume and application materials but must provide accurate information
• Micron advises job seekers to verify authenticity of communications claiming to be from Micron

• Experience in semiconductor packaging or ASIC/DRAM/NAND domains
• Exposure to digital twins or physics-informed ML
• Experience building engineering-focused AI tools or platforms
• Understanding of IC packaging, layout, routing, and simulation
  More Skills
• Artificial Intelligence, IC packaging, Layout, Routing, Simulation
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